2023 International Conference on Materials Science and Intelligent Manufacturing (MSIM2023) will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Topics of interest for submission include, but are not limited to:
Materials Science and Engineering | 材料科学与工程 |
1.Electronic and Magnetic Materials 2. Ceramic and Glass Materials 3. Coupling of Multiple Ferroic Order Parameters 4. Crystal Defect Engineering 5. Crystallographic Domain Engineering 6. Domain Microstructure Evolution 7. Domain Size Effect, Grain Size Effect, Small Particles, Thin Films 8. Nanomaterials and Nanotechnology 9. Ferroic and Inter-ferroic Phase Transformations 10. Fundamentals and Characterization 11. Giant Magnetostrictive Materials and Magnetic Shape Memory Alloys 12. Kinetic Pathways of Phase Transformation and Domain Switching 13. Magnetic Materials 14. Materials Chemistry 15. Multiferroic Materials and Composites 16. Nanotechnology and Materials 17. Shape Memory Alloys and Martensites 18. Biomaterials and Biomedical Engineering | 1.电子和磁性材料 2.陶瓷和玻璃材料 3.多个铁序参数的耦合 4.晶体缺陷工程 5.晶体学领域工程 6.畴微结构演化 7.畴尺寸效应，晶粒尺寸效应，小颗粒，薄膜 8.纳米材料和纳米技术 9.铁和铁间相变 10.基础和特性 11.超磁致伸缩材料和磁性形状记忆合金 12.相变和畴变的动力学途径 13.磁性材料 14.材料化学 15.多铁性材料和复合材料 16.纳米技术和材料 17.形状记忆合金和马氏体 18.生物材料和生物医学工程 |
 Intelligent Manufacturing | 智能制造 |
1. Modeling and Design 2. Intelligent Systems 3. Intelligent mechatronics 4. Micro-Machining Technology 5. Advanced Manufacturing Technology 6. Sustainable Production 7. Rapid Manufacturing 8. Digital Manufacturing (CAx, CAPP, MES, DES, etc.) 9. Micro-Electronic Packaging Technology and Equipment 10. Integrated Manufacturing System 11. Engineering Optimization 12. Quality Monitoring and Control of the Manufacturing Process 13. Manufacturing E-commerce System 14. System Analysis and Industrial Engineering 15. Manufacturing Systems and Industry Application 16. Modeling, analysis and simulation of manufacturing processes Collaborative and Digital Manufacturing for Advancing Product Quality 17. Testing, measuring, monitoring and controlling of manufacturing processes | 1. 建模和设计 2. 智能系统 3. 智能机电一体化 4. 微加工技术 5. 先进制造技术 6. 可持续生产 7. 快速制造 8. 数字化制造(CAx、CAPP、MES、DES等) 9. 微电子封装技术与设备 10. 集成制造系统 11. 工程优化 12. 生产过程的质量监控 13. 制造业电子商务系统 14. 系统分析和工业工程 15. 制造系统和工业应用 16. 制造过程的建模、分析和仿真 17. 制造过程的测试、测量、监视和控制 |
Manuscripts passed the peer-review process by expert reviewers from the conference organizing committee will be accepted and published in the
Submission Guidelines
1.The submitted papers must not be previously published or currently under consideration for publication elsewhere.
2.Please send the full paper(Word+pdf) to the conference SUBMISSION SYSTEM
3.Please submit the full paper, if presentation and publication are both needed.
4.Please submit the abstract only, if you just want to make presentations.
5.Templates download: Templates
6.Should you have any questions, or you need any materials in English, please contact us at luxueyi@ais.cn
Note:
1) Both Abstracts and Full Papers are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is made.
2) All submitted articles should report original results, experimental or theoretical, not previously published or under consideration for publication elsewhere. All articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
