- About MSIM 2025 -

2025 3^rd International Conference on Materials Science and Intelligent Manufacturing

2025 3^rd International Conference on Materials Science and Intelligent Manufacturing(MSIM 2025) will be held in Guangzhou, China from January 10 to 12, 2025. MSIM is an annual conference providing a yearly platform for delegates and members to present and discuss the latest research, and our delegates and members will have many opportunities engage in dialogues about Materials Science and Intelligent Manufacturing. It also provides new insights and bring together scholars, scientists, engineers and students from universities and industry all over the world under one roof. We warmly invite you to participate in MSIM 2025 and look forward to seeing you in MSIM!

▶ Submission

 Please send the full paper(word+pdf) to Submission System : 

Submission (For Chinese Authors)

Submission  (For Other Countries' Authors)

For more information, please click: Submission

▶ Registration

Access the registration system, Fill information and pay online. : 

Registration (For Chinese Authors)

Registration (For Other Countries' Authors)

For more information, please click: Registration

▶ Call For Papers

The topics of interest for submission include, but are not limited to:

Call for Papers

Templates: Downloads

▶ Publication

 All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in theJournal of Physics: Conference Series (JPCS) (ISSN:1742-6596), and submitted to EI Compendex, Scopus for indexing.

Note: All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.